2018年份，设备成色非常新，性能稳定。刚到货4台，可租可售。电话微信同号：13776054406

产品特性：

 • 高速2D+3D检测，可检测至01005元件

 • 高缺陷覆盖率，采用混合式2D+3D检测技术

 • 真实3D轮廓量测技术，采用双雷射单位

 • 具备自动化资料库与离线编程功能的智能化快速编程介面

产品规格：

Optical System

Imaging Method Dynamic Imaging with true 3D profile measurement 

Top Camera 4 Mpix 

Angle Camera N/A 

Imaging Resolution 10 µm, 15 µm (factory setting) 

Lighting Multi-phase RGB+W LED 

3D Technology Single/Dual 3D laser sensors 

Max. 3D Range 20 mm 

Inspection Performance

Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec

4 Mpix@ 15 µm 2D: 120 cm²/sec

4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*

4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*

* Depending on board size and laser resolution

Motion Table & Control

X-Axis Control Ballscrew + AC-servo controller 

Y-Axis Control Ballscrew + AC-servo controller 

Z-Axis Control N/A 

X-Y Axis Resolution 1 µm 

Board Handling

Max PCB Size TR7700 SIII 3D: 510 x 460 mm

TR7700L SIII 3D: 660 x 460 mm

TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane

PCB Thickness 0.6-5 mm 

Max PCB Weight 3 kg 

Top Clearance 25 mm 

Bottom Clearance 40 mm 

Edge Clearance 3 mm [5 mm optional] 

Conveyor Inline

Height: 880 – 920 mm

* SMEMA Compatible

Inspection Functions

Component Missing

Tombstoning

Billboarding

Polarity

Rotation

Shift

Wrong Marking (OCV)

Defective

Upside Down

Extra Component

Foreign Material

Lifted Component

Solder Excess Solder

Insufficient Solder

Bridging

Through-hole Pins

Lifted Lead

Golden Finger

Scratch/Contamination

Dimensions

WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm

TR7700L SIII 3D: 1300 x 1650 x 1650 mm

TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm

Note: not including signal tower, signal tower height 520 mm

Weight TR7700 SIII 3D: 1030 kg

TR7700L SIII 3D: 1250 kg

TR7700 SIII 3D DL: 1150 kg