TR7007D SPI建基于新的3D投影技术,以具成本效益的解决方案提供优异的检验性能。TR7007D在线型检测系统,可自动优化检查路线以提供佳的性能表现。且TRI创新的智能板弯补偿系统可弥补检查过程中的板弯。搭配双光源数字条纹投影检测,TR7007D是可靠的SPI解决方案,可以竞争力的价格提供准确的检测效能。
产品特性:
• 无阴影的双光源数位条纹投影检测
• 优化的走停式设计大精度
• 智能板弯补偿可免除PCB变形的问题
• 锡膏缺陷覆盖率高,低锡桥亦可检出
产品规格:
Optical System
Imaging Method Stop-and-Go Imaging
Camera 4 Mpix or 12 Mpix (factory setting)
Imaging Resolution 6 μm, 10 μm , 15 µm (factory setting)
Lighting RGB True Color LED
3D Technology 2-way Digital Fringe Pattern
Field of View 4 Mpix@ 10 µm: 20.3 x 20.3 mm
4 Mpix@ 15 µm: 30.5 x 30.5 mm
12 Mpix@ 6 µm: 24.4 x 18.4 mm*
12 Mpix@ 10 µm: 40.8 x 30.7 mm
12 Mpix@ 15 µm: 61.2 x 46.1 mm
* 6 μm is not available for TR7007D DL
Inspection Performance
Imaging Speed 4 Mpix: 3 FOVc
12 Mpix: 2 FOVc
12 Mpix CoaXPress: 3 FOVc*
Note: Inspection speed depends on PCB and inspection conditions
* With optional CoaXPress upgrade
Height Resolution @ 6 µm: 0.22 µm
@ 10/15 µm: 0.4 µm
Max. Solder Height @ 6 µm: 210/420 µm
@ 10/15 µm: 420/840 µm
Motion Table & Control
X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control Ballscrew + AC-servo controller
X-Y Axis Resolution 1 μm (up to 0.5 μm with optional linear encoder)
Z-Axis Resolution 1 μm (up to 0.5 μm with optional linear encoder)
Board Handling
Max PCB Size TR70007D: 510 x 460 mm*
TR7007Q DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
* 6 μm is only available for TR7007D, the Max. PCB size is 330 x 310 mm
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm
Conveyor Height 880 – 920 mm
* SMEMA Compatible
Inspection Functions
Defects Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
Measurement Height
Area
Volume
Offset
Dimensions
WxDxH TR7007D: 1000 x 1400 x 1650 mm
TR7007D DL: 1000 x 1500 x 1650 mm
Note: not including signal tower, signal tower height 520 mm
Weight TR7007D: 675 kg
TR7007D DL: 685 kg